Materials for Advanced Packaging

Materials for Advanced Packaging

Daniel Lu, C.P. Wong
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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Kategori:
Tahun:
2008
Penerbit:
Springer
Bahasa:
english
Halaman:
311
ISBN 10:
0387782184
ISBN 13:
9780387782188
File:
PDF, 28.89 MB
IPFS:
CID , CID Blake2b
english, 2008
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